Etching

Etching of SiO2 and Si and ashing of organic matter can be achieved at high speed and high efficiency by heating.

Easy visual measurement of plasma effects. Easy to use by simply irradiating plasma to the plasma checker. The plasma checker can be used in high-temperature environments because the base material is made of metal. Film thickness and material can be changed according to the customer's request.

Hydrophilization of PTFE (Teflon). Water repellent treatment of various materials. Formation of a glass film. etc

Etching of SiO2 and Si, etc. Fabrication of fine circuits such as semiconductor integrated circuits.

Such as hydrophilization of Teflon surface and water repellency of nonwoven fabrics.

Ideal for processing powders and chip capacitors! We have added a rotation mechanism to the vacuum plasma so that the entire surface can be processed at once!