Equipment capable of simultaneously processing two films by direct plasma using dielectric barrier discharge and immediately afterward thermo-compression bonding.

The industry’s first safe plasma CVD that directly deposits films from liquid raw materials.

Etching of SiO2 and Si and ashing of organic matter can be achieved at high speed and high efficiency by heating.

Easy operation from a PC. High-precision powder feeding by stepping motor drive. Linkage with an electronic balance with communication function (optional) enables even higher precision feeding. Desktop type, compact.

Easy-to-use interface with touch panel control of supply volume. Continuous processing in combination with atmospheric pressure liquid surface plasma system.

Highly uniform thin film (on the order of several micrometers is possible). Coated under room temperature and atmospheric pressure, not under high temperature and vacuum. Easy to clean because the mask plate is not contaminated.

A coating method that forms a thin film by immersing a substrate in a liquid and pulling it up. Film thickness can be controlled by the speed at which the substrate is pulled up. Film thickness can be controlled at any pull-up speed. Coating is possible even on uneven substrates. Maintenance is easy because no special container is required. Applicable to custom sizes. Minimal waste of immersed liquid because the coating process is completed inside the container.

Combined with the atmospheric pressure plasma system, the irradiation accuracy is improved! The PC control system can be freely programmed.

Can be combined with our atmospheric pressure plasma system. Ideal for continuous treatment of linear samples. Can be installed in the processing section for your desired process. Applicable to any size. Can be rewound at any speed.

Complete line from unwind to rewind in the production processing section! Easy installation of your desired process. We can also accommodate any dimensions desired by the customer. Speed and tension can also be set as desired, allowing for a high degree of process flexibility.