Cleaning / Sterilization

Equipment capable of simultaneously processing two films by direct plasma using dielectric barrier discharge and immediately afterward thermo-compression bonding.

Etching of SiO2 and Si and ashing of organic matter can be achieved at high speed and high efficiency by heating.

Highly uniform thin film (on the order of several micrometers is possible). Coated under room temperature and atmospheric pressure, not under high temperature and vacuum. Easy to clean because the mask plate is not contaminated.

A coating method that forms a thin film by immersing a substrate in a liquid and pulling it up. Film thickness can be controlled by the speed at which the substrate is pulled up. Film thickness can be controlled at any pull-up speed. Coating is possible even on uneven substrates. Maintenance is easy because no special container is required. Applicable to custom sizes. Minimal waste of immersed liquid because the coating process is completed inside the container.

Combined with the atmospheric pressure plasma system, the irradiation accuracy is improved! The PC control system can be freely programmed.

Easy visual measurement of plasma effects. Easy to use by simply irradiating plasma to the plasma checker. The plasma checker can be used in high-temperature environments because the base material is made of metal. Film thickness and material can be changed according to the customer's request.

Easy storage of images and contact angle data on the attached PC. Droplet volume can be controlled from 0.1μL. Still and moving images can be saved.

Hydrophilization of PTFE (Teflon). Water repellent treatment of various materials. Formation of a glass film. etc

Making materials hydrophobic. Waterproofing of cloth and paper, stain proofing, moisture proofing. Waterproofing of electronic parts, etc.

Etching of SiO2 and Si, etc. Fabrication of fine circuits such as semiconductor integrated circuits.