Powder processing

Improved powder dispersion by plasma in liquid. Improved production efficiency through continuous processing. Plasma treatment while breaking up agglomerations by impact group. For pre-treatment of powder plating.

Powders do not scatter because the process is windless. Powders and liquids that were previously not mixed at all are mixed together. This promotes the cohesion of difficult-to-form materials, making them easier to process.

Mixed with liquid by surface treatment of powder without surfactant. Pretreatment: Pretreatment of fillers and calcined powders. Others: For development of hybrid materials.

The technology is based on the supply of gas to powder to make it flow like a liquid (fluidised bed, fluidised bed).

A rotary stirring mechanism is introduced in the vacuum chamber. Dry and full-surface batch processing. Stirred in glow discharge to ensure high uniformity. Since it is a rotary type, there is no need to turn over small parts such as chips. Etching, thin film formation, water repellency, redox of powders and small parts.

Ideal for processing powders and chip capacitors! We have added a rotation mechanism to the vacuum plasma so that the entire surface can be processed at once!