- Vacuum
- Powder processing
- Gas-less processing
- Painting / Plating
- Adhesion / Bonding
- Dispersion / Cohesion improvement
- Cultivation / Dental Care
- Cleaning / Sterilization
- For experimental use
- Processing to special shapes (film, powder, tube, three-dimensional objects, etc.)
Small rotary vacuum plasma system MUG-80
A rotary stirring mechanism is introduced in the vacuum chamber. Dry and full-surface batch processing. Stirred in glow discharge to ensure high uniformity. Since it is a rotary type, there is no need to turn over small parts such as chips. Etching, thin film formation, water repellency, redox of powders and small parts.
Product Overview
Rotary stirring mechanism introduced in the vacuum chamber
Dry and full-surface batch processing
Stirred in glow discharge to ensure high uniformity
Since it is rotatable, there is no need to turn over small parts such as chips.
Etching, thin film formation, water repellency, redox of powders and small parts
Specification
Device name: Small rotary vacuum plasma device
Model MUG-80
External dimensions 400mm(W)×353mm(D)×340mm(H)
Weight 30kg
Rotating part φ80×42mm(D)
Output adjustment
Gas system options
Gas control method options
Pressure adjustment option
Power supply 100V, 15A (50Hz/60Hz)