Adhesion / Bonding

Equipment capable of simultaneously processing two films by direct plasma using dielectric barrier discharge and immediately afterward thermo-compression bonding.

Etching of SiO2 and Si and ashing of organic matter can be achieved at high speed and high efficiency by heating.

Combined with the atmospheric pressure plasma system, the irradiation accuracy is improved! The PC control system can be freely programmed.

Easy visual measurement of plasma effects. Easy to use by simply irradiating plasma to the plasma checker. The plasma checker can be used in high-temperature environments because the base material is made of metal. Film thickness and material can be changed according to the customer's request.

Easy storage of images and contact angle data on the attached PC. Droplet volume can be controlled from 0.1μL. Still and moving images can be saved.

Hydrophilization of PTFE (Teflon). Water repellent treatment of various materials. Formation of a glass film. etc

Making materials hydrophobic. Waterproofing of cloth and paper, stain proofing, moisture proofing. Waterproofing of electronic parts, etc.

Etching of SiO2 and Si, etc. Fabrication of fine circuits such as semiconductor integrated circuits.

A vacuum plasma device capable of introducing various gases. Gas flow adjustment, power adjustment, vacuum degree monitor Precise processing conditions can be set. We will provide it in a low price range that is easy to introduce with simple one-touch operability ~ ♪ Surface treatment/ Treatment before thin film formation/ Treatment before anodic bonding/ Treatment before painting/ Other/ Also in the biotechnology and medical fields.

It is compact and inexpensive. Surface treatment Treatment before thin film formation Treatment before anodic bonding Treatment before painting Other Also in the biotechnology and medical fields.