• Process gas available
  • Vacuum
  • With high frequency generator
  • Painting / Plating
  • Adhesion / Bonding
  • Cultivation / Dental Care
  • Cleaning / Sterilization
  • Etching
  • Thin film formation
  • Hydrophobic
  • Plasma durability test
  • Lipophobic / Stain repellency (under development)
  • Lipophilic (under development)
  • For experimental use
  • For manufacturing

Plasma Etcher CPE Series

Etching of SiO2 and Si, etc. Fabrication of fine circuits such as semiconductor integrated circuits.

Product Overview

■Compact
■Easy to use
■ Touch panel operation (auto, manual)
■High-precision etching of inorganic materials is possible

Specification

Device name: Plasma etcher
Model CPE-200A
External dimensions: 510mm(W)×760mm(D)×1090mm(H)
Discharge part dimensions: diameter 200mm (circular)
weight
Output adjustment : Yes
Gas system: 1 system (2 lines optional)
Gas Control Method Mass Flow Controller
Pressure regulating valve
Power supply AC100V,15A(50Hz/60Hz)