Product Information

There is almost no heat damage!

Equipment capable of simultaneously processing two films by direct plasma using dielectric barrier discharge and immediately afterward thermo-compression bonding.

The industry’s first safe plasma CVD that directly deposits films from liquid raw materials.

Etching of SiO2 and Si and ashing of organic matter can be achieved at high speed and high efficiency by heating.

Easy storage of images and contact angle data on the attached PC. Droplet volume can be controlled from 0.1μL. Still and moving images can be saved.

Easy operation from a PC. High-precision powder feeding by stepping motor drive. Linkage with an electronic balance with communication function (optional) enables even higher precision feeding. Desktop type, compact.