Dispersion / Cohesion improvement

Easy operation from a PC. High-precision powder feeding by stepping motor drive. Linkage with an electronic balance with communication function (optional) enables even higher precision feeding. Desktop type, compact.

Easy-to-use interface with touch panel control of supply volume. Continuous processing in combination with atmospheric pressure liquid surface plasma system.

Improved powder dispersion by plasma in liquid. Improved production efficiency through continuous processing. Plasma treatment while breaking up agglomerations by impact group. For pre-treatment of powder plating.

Powders do not scatter because the process is windless. Powders and liquids that were previously not mixed at all are mixed together. This promotes the cohesion of difficult-to-form materials, making them easier to process.

Mixed with liquid by surface treatment of powder without surfactant. Pretreatment: Pretreatment of fillers and calcined powders. Others: For development of hybrid materials.

The technology is based on the supply of gas to powder to make it flow like a liquid (fluidised bed, fluidised bed).

Ideal for processing powders and chip capacitors! We have added a rotation mechanism to the vacuum plasma so that the entire surface can be processed at once!